TSMC continues to push the limits of technology as it plans to begin trial production of sub-1nm chips by 2029. This is considered a major milestone, marking a new phase in the global journey of semiconductor miniaturization.
According to DigiTimes, TSMC is not only focusing on current process nodes but is also building a long-term roadmap to maintain its leadership in chip manufacturing. Before reaching sub-1nm, the company is expected to roll out 2nm chips in the near future, paving the way for a new generation of processors in high-end devices.
Following that, the 1.4nm (A14) process is projected to enter mass production in 2028, with expected improvements of up to around 30% in both performance and energy efficiency.
By 2029, TSMC will begin trial production of sub-1nm chips at an initial scale of approximately 5,000 wafers per month. This plan will leverage multiple facilities, including the Tainan A10 plant and fabs P1–P4, to ensure production capacity.
However, the biggest challenges remain technical. As process nodes shrink further, yield rates per wafer typically drop significantly in the early stages, leading to higher production costs. This could delay large-scale commercialization compared to initial expectations.
At the same time, TSMC is under significant pressure from the booming demand for AI chips. Current manufacturing capacity is nearing its limits, making allocation increasingly difficult.
According to Wccftech, this situation is already impacting the smartphone market. Many vendors are adjusting their strategies, equipping only premium models with the latest chips, while standard versions continue to use previous-generation processors.
This also means that even if 2nm and 1.4nm nodes launch on schedule, not all high-end devices will be able to adopt these technologies immediately.
