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Intel and Google are expanding their long-term partnership to advance AI infrastructure, reinforcing the growing importance of CPUs in large-scale AI deployment. As the market shifts from GPU-centric...
Samsung is developing a Vertical Die (V-die) architecture that could boost HBM performance with up to 10x higher I/O density and 4x greater bandwidth by rethinking chip stacking design. By combining n...
Samsung and Amkor are rapidly expanding chip packaging investments in Vietnam, positioning the country as a rising hub in the global semiconductor supply chain amid booming AI demand.
Samsung Electronics has successfully resolved one of the most critical technical challenges in its SOCAMM2 design: the “warpage” issue, a major barrier to mass production.
Intel has partnered with Elon Musk and Tesla on the Terafab project to build a massive U.S.-based chip manufacturing ecosystem aimed at supporting growing AI demand. The collaboration leverages Intel’...
Samsung has raised DRAM prices by ~30% in Q2 2026, extending a sharp uptrend that is likely to be followed by SK Hynix and Micron. As memory now accounts for over 50% of smartphone component costs, ri...
According to TrendForce, AI-driven server demand is pushing DRAM and NAND Flash prices sharply higher in Q2 2026, with increases of 58–63% and 70–75% QoQ respectively amid tight supply. As CSPs lock i...
Rising memory costs are forcing MediaTek and Qualcomm to cut 4nm wafer output, as higher device prices begin to weaken smartphone demand. With memory accounting for a growing share of device costs, th...
The DRAM spot market has remained soft for both DDR4 and DDR5. End-user demand continues to fall short of absorbing current price levels, while contract prices for 2Q26 have yet to be finalized.
Samsung Electronics is accelerating its push toward 1nm by 2030 while improving 2nm yields beyond 60%, signaling stronger manufacturing readiness and a potential return to profitability. As competitio...
Micron Technology is developing stacked GDDR for AI inference, aiming to deliver a lower-cost alternative to HBM with prototypes expected by 2027. While it offers advantages in cost and scalability, i...
Samsung Electronics is accelerating its transition to advanced NAND technologies at its Xi’an plant, moving from 128-layer to 236-layer and preparing for 286-layer production, driven by competitive pr...
